Low processing heat resulting in less damage to the cut surface so reaches a smoother surface; all-in-one laser design, easy to install and maintain; superior beam quality can achieve deeper and faster processing, more advantageous in cutting SiC, diamond and other super hard materials; self-cleaning system of resonant cavity solves the problem of power attenuation to maintain a long service life.

Features:

• Single pulse energy ＞ 1mj
• Superior beam quality M²＜1.3
• Ultra-long service life and power stability
• All-in-one machine mechanism, small size

Application

• SiC wafer scribing
• Diamond cutting – Slicing, coring, sawing, faceting, 4 processing
• Cutting of super hard materials – PcBN, PCD, SCD, CVD, SiC, etc.