Higher peak power of the laser enables greater processing capability and efficiency, particularly in cutting ultra-hard materials

like silicon carbide and diamond.The laser system is highly integrated, incorporating the laser, power supply, Q-switching control, and protection circuits into a compact and easy-to-install unit, facilitating maintenance. The internal resonator cavity is equipped with a self-cleaning system and stable cavity design, addressing power attenuation issues and ensuring an extended lifespan.

Features:

Single pulse energy1.6~2mj

Superior beam quality M²<1.5

Ultra-long service life and power stability

All-in-one compact design

Application:

Diamond slicing & coring

Diamond shape cutting (4Processing for 4mm+diamonds)

Carbon fiber cutting

Sic wafer dicing

Super hard material cutting