Higher peak power of the laser enables greater processing capability and efficiency, particularly in cutting ultra-hard materials like silicon carbide and diamond. The laser system is highly integrated, incorporating the laser, power supply, Q-switching control, and protection circuits into a compact and easy-to-install unit, facilitating maintenance. The internal resonator cavity is equipped with a self-cleaning system and stable cavity design, addressing power attenuation issues and ensuring an extended lifespan.

Features：

Single pulse energy>1.8mj

Superior beam quality M²<1.3

Ultra-long service life and power stability

All-in-one compact design

Application：

Diamond slicing&coring

Diamond shape cutting(4P processing for 4mm+diamonds)

Carbon fiber cutting

Sic wafer dicing

Super hard material cutting