MMEPU-355-15-HE

The high-energy ultraviolet laser, characterized by a wavelength of 355nm, features a single-pulse energy of 1.5mJ and a high peak power. It efficiently cuts SiC and diamond wafers, directly severing the wafers and metal layers with high efficiency and a minimal edge breakage (<2um).

Features

  • The laser power is 15W;
  • Adopt UV-clean patented technology to solve power attenuation worry free used;
  • The service life exceeds 20000 hours, maintenance is free, and no need for regular commissioning or calibration;
  • Excellent beam quality M² < 1.3, simple process, and higher efficiency;
  • 3-layer protection, protection grade IP65, more suitable for harsh working environment;
  • Rugged, easy to install, and easy to integrate.

Application

  • Sic, diamond wafer scribing and drilling
  • Ceramic scribing and drilling

Description

Model No.MMEPU-355-15-HE
Optical Characteristics 
Wavelength (nm)355nm
Average Power (W)>15W@10kHz
Single Pulse Energy (uJ)~1500uJ@10kHz
Pulse Width (ns)~30ns@60kHz
Frequency range10-20kHz
Pulse Stability<3% rms
Long Term Stability<±3%
Beam Characteristics 
Polarization RatioHorizontal;>100:1
Beam Diameter〜1mm(at exit)
Beam Circularity>90% 
Spatial ModeTEM00, M² <1.3
Operating Specifications 
Warm-up Time<15minutes from cold start
Electrical RequirementDC17.5V,350W
Ambient Temperature10-35℃,RH<80%
Storage Conditions-10-40℃,RH<90% 
Physical Characteristics 
Cooling SystemWater-Cooled
Water Temperature (laser inlet)25℃