Diamond Series

Diamond series lasers

Applications:Industrial Manufacturing, Superhard Materials

The Diamond series solid state lasers are specially designed for cutting, drilling, etching and other precision machining needs of carbon and ultra-hard materials such as diamond, SiC, carbon fiber and so on. They solve the problem that traditional fibre lasers and solid state lasers are difficult to achieve an etching depth of more than 3mm on ultra-hard materials due to their low energy.

Diamond series lasers have high single pulse energy, which makes it able to etch and process deeper on super-hard materials, breaking through the limitations of traditional lasers that can only be processed to a certain depth and then can not continue to extend downwards. This greater processing capability makes it more efficient in processing ultra-hard materials.

In addition, Diamond series lasers also provide a variety of pulse width options, which provides a variety of possible process options for the processing of ultra-hard materials, and can be flexibly selected and adjusted according to different material characteristics and processing needs, further improving processing efficiency and quality.

diamond processing laser

Products

ProductModelAverage Power (W)Single Pulse Energy (uJ)Frequency RangePulse Width (ns)ApplicationLearn more
Maiman mini UV laser
355nm
MMEPU-D-355-1>1W@20KHZ~50uJ@20KHZUncontrollable
range 15-20KHZ
~7ns@20KHZDiamond girdle marking
Electronic products marking
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high energy uv laser
355nm
MMEPU-355-10-HE-D30>10W@10kHz~1000uJ@10kHz10kHz-100kHZ<30ns@10kHz

Diamond cutting – slicing and coring

Super hard material cutting – PcBN, PCD, SCD and CVD diamond, SiC, etc.

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high energy uv laser
532nm

MMEPG-532-16-HE-D30>16W@10kHz~1600uJ@10kHz7kHz-100kHZ<30ns@10kHzDiamond slicing & coring
Diamond shape cutting (4 Processing for 4mm+ diamonds)
Carbon fiber cutting
Sic wafer dicing
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MMEPG-532-20-HE-D30>20W@10kHz~2000uJ@10kHz7kHz-100kHZ

high energy uv laser
1064nm

MMEPA-1064-18-HE-D30>18W@10kHz~1800uJ@10kHz7kHz-100kHZ<30ns@10kHzClick Here
MMEPA-1064-25-HE-D30>25W@10kHz~2500uJ@10kHz7kHz-100kHZ

532nm
MMEPG-532-16-HE-D70>16W@10kHz~1600uJ@10kHz7kHz-100kHz<70ns@10kHz

Drilling in brittle materials

Carbon material cutting

Laser trimming

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MMEPG-532-20-HE-D70>20W@10kHz~2000uJ@10KHZ7kHz-100kHz
 
1064nm
MMEPA-1064-18-HE-D70>18W@10kHz~1800uJ@10kHz7kHz-100kHZ<70ns@10kHzClick Here
MMEPA-1064-25-HE-D70>25W@10kHz~2500uJ@10KHZ7kHz-100kHZ
gem planning IR laser
1064nm
MMD-YAG-1064-1>1W@12kHz~30uJ@12kHz~12kHz~12ns@12kHzGem planning
Diamond marking
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