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Diamond Wafer Processing

Working with high-performance materials like diamond wafers poses a significant challenge in today’s fast-growing semiconductor industry.  Traditional grinding methods have limitations due to their inefficiency, high cost, and the risk of damaging large wafers (e.g., 2-inch).  To address this issue, Maiman has introduced the DIAMOND series of UV lasers, offering promising solutions[...]
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Pulse laser technology is revolutionizing peelable fabric substitution

Amidst the surge of technological advancements, pulse laser technology emerges as a brilliant star, profoundly reshaping various industries with its rapid development. From medical to manufacturing, communication to material science, laser technology rapidly reshapes our perception of the future. Once, peelable fabric was the traditional choice for resolving adhesion and separation issues.[...]
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