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The 6th Shenzhen International Semiconductor Technology & Application Expo
Tianjin Maiman Laser Technology Co., Ltd. is very honored to participate in SEMI-e 2024 6th Shenzhen International Semiconductor Exhibition, this exhibition attracts a lot of customers to visit, get a lot of advice, show the latest technology and innovation related to the processing of semiconductors and super-hard materials, etc., and learn about[...]
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What Laser is Better for Cutting Diamonds
Using a laser to cut diamonds results in smaller cuts and better results, and choosing the right laser is critical to the quality and efficiency of diamond cutting. Common lasers used for diamond cutting are femtosecond, ultraviolet, green, and infrared lasers. Advantages of laser cutting diamonds 1. Fine focusing The laser beam[...]
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News update
The 6th Shenzhen International Semiconductor Technology & Application Expo is coming soon
Dear valued customers, Tianjin Maiman Laser will participate in The 6th Shenzhen International Semiconductor Technology and Application Expo (SEMI-e) in June 2024. As a leading company in the laser industry, we would like to invite you to visit our booth at the exhibition. Event Details: Exhibition: The 6th Shenzhen International Semiconductor Technology[...]
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Diamond Processing with Laser Technology
Laser processing is a prominent method, bringing about revolutionary changes in diamond processing owing to its unique mechanisms and advantages. 1. The allure and hurdles of diamonds Diamond, renowned as “nature’s hardest substance” due to its exceptional hardness, wear resistance, and optical properties, presents formidable challenges in processing. Traditional methods often[...]
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How Crystal Structure Influences Diamond Cutting
Diamond, hailed as the “King of Gemstones,” boasts distinctive physical and chemical properties stemming from its tetragonal crystal structure. Among these, the covalently bonded carbon atoms play a pivotal role in CVD cutting. This article delves into the impact of a diamond’s crystal structure on its response to laser cutting. Characteristics[...]
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Recent Blogs
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